cover image: Environmental and Social Commitment Plan (ESCP) Higher Education Quality and Innovation Project (P178592) (English)

20.500.12592/hqbznzc

Environmental and Social Commitment Plan (ESCP) Higher Education Quality and Innovation Project (P178592) (English)

28 Nov 2023

europe and central asia kyrgyz republic secondary education tertiary education

Authors

Borrowing Agency

Disclosure Date
2023/11/28
Disclosure Status
Disclosed
Doc Name
Environmental and Social Commitment Plan (ESCP) Higher Education Quality and Innovation Project (P178592)
Originating Unit
Education ECA (HECED)
Product Line
IBRD/IDA
Published in
United States of America
Rel Proj ID
KG-Higher Education Quality And Innovation Project -- P178592
Sector
Secondary Education,Tertiary Education
Theme
Education,Teachers,Education Governance, School-Based Management,Adaptation,Climate change,Rural Infrastructure and service delivery,Labor Market Policy and Programs,Standards, Curriculum and Textbooks,Education Financing,Access to Education,Rural Development,ICT Solutions,Education Facilities,Skills Development,ICT,Science and Technology,Mitigation
Unit Owning
Education ECA (HECED)
Version Type
Final

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